Film ceramic HDI PCB circuit board with high performance
$78.90
Film Ceramic HDI PCB is a high-performance circuit board that combines ceramic substrate and high density interconnect (HDI) technology. Through thick film and thin film deposition technology, conductive traces can be accurately formed on the ceramic substrate. The ceramic materials, such as aluminum nitride, aluminum oxide, and silicon carbide, have excellent thermal conductivity, electrical insulation, and structural stability, which significantly improve the thermal management and reliability of the film ceramic HDI circuit board.
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| Layer Counts | 4L |
| Base Material | Aluminum nitride (AlN) |
| Board Thickness(mm) | 0.8 |
| Max board size(mm) | 570*850 |
| PCB size tolerance | ±0.3mm |
| Min. Hole Size | 0.15mm |
| Min. Line Width | 5mil |
| Copper Weight | 2oz |
| Surface Finish | ENEPIG |
| Certificate | UL, RoHS, ISO, and REACH |
Film ceramic HDI PCB circuit board with high performance
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Questions & Answers
1.How can I pay for my order?
We support multiple payment methods, including T/T, West Union, Money Gram, L/C, and PayPal (for sample orders). For specific details, kindly reach out to our sales representatives.
2.What industries do you serve?
We cater to a wide range of industries such as medical, consumer electronics, automotive, industrial, telecommunications, and the Internet of Things (IoT).
3.Why choose ceramic over traditional FR4 for HDI PCBs?
Ceramic offers much higher thermal conductivity, lower signal loss at high frequencies, and better stability in extreme temperatures compared to traditional FR4. These advantages make them ideal for power electronics, RF/microwave, and harsh environments.
4.How does the thermal performance of film ceramic PCBs compare to that of metal core PCBs?
Film ceramic PCBs offer superior thermal conductivity (30–180 W/mK) compared to metal-core PCBs (typically <5 W/mK).
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