PCB Assembly Capabilities
PCB Assembly Capabilities for Superior Performance
MOKOPCB delivers precise and reliable PCB assembly services, ensuring superior performance for every project. With advanced equipment and extensive expertise in SMT, through-hole technology, and mixed technology, we handle complex assemblies with utmost accuracy. Whether you need prototyping or large-scale production, MOKOPCB guarantees exceptional quality results. Explore our detailed assembly capabilities in the content below.
| Features | Capabilities |
|---|---|
| Assembly options | SMT, THT, hybrid of both |
| PCB size | 50*50mm--650*370mm |
| Board thickness | 0.40--6.0mm |
| Board shape | Rectangular, circular, and other irregular shape |
| Board type | Rigid, flexible boards, multilayer PCB |
| Component procurement | Full& partial turnkey, consigned/kitted |
| Component size | As small as 0201,0402 for passive component |
| Package Types | BGA, uBGA. QFN, QFP, Flip chip, PLCC, Package On Package... |
| Pin pitch | ≥0.30mm |
| Assembly accuracy | ±35um |
| SMT Assembly capacity | Up to 2 Million PCS/month |
| DIP production capacity | 3600K components/month |
| Solder types | Leaded and lead-free assembly |
| Stencils | Nano-coating, Laser-cut stainless steel |
| Repair & Rework | Ball Grid Array replacement, IR rework |
| Lead Time | 1-3 days for prototyping, 7- 15 days for mass production |
| Testing methods | Visual inspection, AOI testing, X-ray inspection, In-circuit test, functional test |
| Certification | ISO9001, ISO13485, IPC610, UL |
Ready to bring your electronic designs to life? Contact us now with your PCB assembly requirements for a customized quote.
