FR4 Tg 180 PCB
$35.50
The FR4 Tg 180 PCB is engineered for high-performance applications operating under extreme thermal conditions, such as aerospace, industrial control, computing, and telecommunications systems. They provide superior stability and mechanical robustness than standard and medium Tg materials, but also cost more than other material PCBs.
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| Layer Counts | 8L |
| Base Material | FR4 |
| Board Thickness(mm) | 2.4mm |
| Max board size(mm) | 570*670mm |
| PCB size tolerance | ±0.2mm |
| Min. Hole Size | 0.15mm |
| Min. Line Width | 4mil |
| Copper Weight | 1oz |
| Surface Finish | ENIG |
| Certificate | ISO9001, ISO13485, IPC610, UL |
FR4 Tg 180 PCB
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Questions & Answers
1. What is your lead time?
Generally, 1-2 days. We have our own warehouse and stock in large quantities.
2. What’s the advantage of the ENIG surface finish?
The ENIG offers a flat surface, which is ideal for fine-pitch components. It also resists oxidation better than HASL, ensuring reliable solder joints.
3. Why use a FR4 high Tg PCB rather than a standard FR4 PCB?
High Tg FR4 PCBs like Tg180 are more reliable than standard FR4 PCBs due to their better thermal, chemical, and mechanical properties, reducing the likelihood of board failure influenced by high temperatures. What’s more, one important reason for the high Tg PCBs lies in they can withstand the lead-free soldering process, which can handle the movement to RoHS. Lead-free solders require higher reflow soldering temperatures(≥230°C), and only high Tg PCB is capable of solving it without destroying structural integrity.
4. Is this high Tg180 FR4 PCB suitable for HDI(High-Density Interconnect)?
Yes, high Tg FR4 PCB can be used in HDI PCBs, but its suitability depends on concrete applications.
5. What other surface finishes are recommended for high Tg180 PCB?
Except for ENIG, you can also consider ENEPIG for harsh environments, Hard Gold for high-wear connectors, and Immersion tin for cost saving. Contact us with your needs, our experts will give you suitable advice.
6. How does high Tg reduce delamination risks in multilayer PCBs?
The superior thermal and mechanical stability of the multilayer high-Tg PCB helps reduce delamination risks. Low CTE prevents excessive layer separation at high temperatures, and a robust resin structure maintains strong adhesion. Additionally, high-Tg laminates are not easily subject to moisture absorption, which reduces welling-induced failures.
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