RoHS High Frequency PCB
$87.90
RoHS high-frequency PCB is an advanced printed circuit board that balances the high-frequency signal integrity and strict environmental compliance. Complying with EU RoHS(Restriction of hazardous substances), the HF PCB utilizes lead-free soldermask and finishes. It is widely used in various high-frequency devces such as 5G, radar, and satellite communications.
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| Layer Counts | 4L |
| Base Material | Rogers |
| Board Thickness(mm) | 1.6mm |
| Max board size(mm) | 570*850mm |
| PCB size tolerance | ±0.2mm |
| Min. Hole Size | 0.15mm |
| Min. Line Width | 4mil |
| Copper Weight | 1oz |
| Surface Finish | ENIG |
| Certificate | UL, IPC-6012, RoHS, ISO 9001, ISO14001 |
RoHS High Frequency PCB
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Questions & Answers
1. Can you support small-volume or prototype orders?
Yes, we fully support low-volume and large-scale production runs.
2. What poisonous substances are prohibited by the RoHS(Restriction of Hazardous Substances) EU Directive?
10 substances are prohibited: Lead (Pb), Cadmium (Cd), Mercury (Hg), Hexavalent Chromium (Cr6+), Brominated Flame Retardants (PBBs, PBDEs), Four phthalates (DEHP, BBP, DBP, DIBP)
2. How does RoHS impact high frequency PCB design?
In the past, tin-lead solder was widely used in electronic devices to join the components and protect the copper from corrosion. However, tin-lead solder is prohibited, and its substitute lead-free solder requires high Td(decomposition temperature) material with a higher cost, or it will increase thermal profiles and dwell times.
3. What material certifications do you provide?
We provide UL, IPC-6012, RoHS, ISO 9001, and ISO14001 for all of our high-frequency PCBs.
4. Except lead-free, is your high frequency PCB fully RoHS compliant in all respects?
Yes, all of our high-frequency PCBs stick to EU RoHS. Compliance extends to all materials, including the substrate, solder mask, surface finishes, and inks.
5. What surface finishes do you provide?
We support ENIG(excellent corrosion resistance and solderability), Immersion silver(IAg)(suitable for high-speed signals), Immersive tin(I-Sn)(solderability and flatness), ENEPIG(superior durability), and OSP(low cost). Avoid using Hot Air Solder Leveling (HASL), as it can introduce excessive thickness variations and degrade high-frequency performance.
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